Thermally Conductive

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Mix Ratio ▲▼

Viscosity ▲▼

Extrusion Rate ▲▼

Thermal Conductivity ▲▼

Data Sheet

Comment

Platinum

20:1

0.64 W/(mK)

Primed w/CF1-135, Contains Boron Nitride

Platinum

1:1

36,000 cP

0.95 W/(mK)

Recommended for bondlines 5 micron or greater.

Platinum

10:1

900,000 cP

1.11 W/(mK)

*22) 1.1 W/mK

Non-Curing

0.68 W/(mK)

Versatile, thermally conductive grease where thin bondlines or a compressible grease is needed. Non-curing.

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