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Thermally Conductive

Product
Cure System
Mix Ratio
Viscosity
Extrusion Rate
Thermal Conductivity
Data Sheet
Comment
Platinum
15:1
1.46 W/(mK)
Data Sheet
Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride)
Oxime
1 PART
N/A
40 g/minute
0.61 W/(mK)
Data Sheet
*22) 0.6 W/mK, Low Temperature
Platinum
20:1
140 g/minute
0.64 W/(mK)
Data Sheet
0.64 W /mK (Tested per ASTM E1530)
Platinum
15:1
3,750,000 cP
1.6 W/(mK)
Data Sheet
Primed w/CF1-135, Contains Boron Nitride
Platinum
1:1
36,000 cP
0.95 W/(mK)
Data Sheet
Recommended for bondlines 5 micron or greater.
Platinum
15:1
3,672,800 cP
1.49 W/(mK)
Data Sheet
1.5 W/mK, 160 psi lap shear primed w/CF1-135, 2 hr. pot life. (Contains Boron Nitride)
Platinum
1:1
2,000 cP
0.4 W/(mK)
Data Sheet
0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV.
Platinum
1:1
4,000 cP
0.5 W/(mK)
Data Sheet
0.6 W/mK, versatile, moderate thermally conductive silicone. Will RTV.
Showing 17 to 24 of 24 entries