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Thermally Conductive
Product
Cure System
Mix Ratio
Viscosity
Extrusion Rate
Thermal Conductivity
Data Sheet
Comment
Platinum
15:1
75,000 cP
0.75 W/(mK)
For applications requiring a broader operating temperature range. (Contains Boron Nitride)
Platinum
15:1
3,672,800 cP
1.49 W/(mK)
1.5 W/mK, 160 psi lap shear primed w/CF1-135, 2 hr. pot life. (Contains Boron Nitride)
Platinum
1:1
4,000 cP
0.5 W/(mK)
0.6 W/mK, versatile, moderate thermally conductive silicone. Will RTV.
Platinum
1:1
2,000 cP
0.4 W/(mK)
0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV.
Platinum
15:1
N/A
N/A
1.25 W/(mK)
50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)