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EPM-2490 LOW VOLATILITY THERMALLY CONDUCTIVE SILICONE ADHESIVE

Description

  • Two-part, white, thermally conductive, electrically insulating, silicone system
  • Electrically insulative and non-corrosive
  • 15:1 Mix Ratio (Part A: Part B)

Applications

  • Flexible Thermal interface material (TIM) designed to provide heat transfer between electrical/electronic components and their heat sinks for a variety of component level packaging
  • For applications requiring a broad operating temperature range
  • Ideal where a form-in-place TIM is needed for use as a sealing, caulking, adhesive, or potting material in electronics applications requiring minimal volatility for prevention of contamination in sensitive devices


Product Details

PROPERTYAVERAGE RESULT
Thermal Conductivity1.49 W/(mK)
Viscosity3,672,800 cP (3,672,800 mPa*s)
Cure SystemPlatinum
Tensile200 psi (1.38 MPa)
AppearanceWhite
Durometer75 Type A
Elongation30 %
Flow Rate0.3 in (7.62 mm)
Ionic Content Cl<3 ppm
Ionic Content K<3 ppm
Ionic Content Na<6 ppm
Lap Shear160 psi (1.1 MPa)
Mix Ratio15:1
Specific Gravity1.53
Tack Free Time4.5 hours
Tear50 ppi (8.82 kN/m)
Work Time2 hours
Comment1.5 W/mK, 160 psi lap shear primed w/CF1-135, 2 hr. pot life. (Contains Boron Nitride)

Encapsulation Technology

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please Contact NuSil for assistance and recommendations in establishing limits for product specifications.

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