EPM-2480 DIELECTRIC SILICONE GEL
Description
- Two-part, clear silicone gel
- 1:1 Mix Ratio
- (Part A: Part B)
Applications
- For applications requiring low volatility
- Useful for potting intricate assemblies due to a low viscosity
- As an embedding or potting compound for environmental protection of electronic assemblies and components
Product Details
| PROPERTY | AVERAGE RESULT |
|---|---|
| Viscosity | 2,500 cP (2,500 mPa*s) |
| Penetration | 4 mm |
| Work Time | 30 hours |
| Appearance | Clear |
| Cure | 30 minutes / 150 °C |
| Cure System | Platinum |
| Ionic Content Cl | <5 ppm |
| Ionic Content K | <1 ppm |
| Ionic Content Na | <2 ppm |
| Mix Ratio | 1:1 |
| Volume Resistivity | 100,000,000,000,000 ohmcm |
| Comment | Soft High Tack Gel |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please Contact NuSil for assistance and recommendations in establishing limits for product specifications.
Speak with an Expert
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