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Adhesives/Sealants - Aerospace/Defense
Two-part film adhesive
Cures at room temperature or rapidly with heat
Cures at room temperature or rapidly with heat
Thermally Conductive
Two-part, white, thermally conductive, low viscosity silicone
elastomer
Cures with the addition of heat
1:1 Mix Ratio (Part A: Part B)
elastomer
Cures with the addition of heat
1:1 Mix Ratio (Part A: Part B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
20:1 Mix Ratio (Part A: Part B)
Cures with the addition of heat
20:1 Mix Ratio (Part A: Part B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
Mix Ratio 10:1 (Part A:B)
Designed for enhanced performance in extreme low and high temperatures
Cures with the addition of heat
Mix Ratio 10:1 (Part A:B)
Designed for enhanced performance in extreme low and high temperatures
Thermally Conductive
Two-part, white, flowable, thermally conductive silicone
Cures with the addition of heat
10:1 Mix Ratio (Part A:Part B)
Cures with the addition of heat
10:1 Mix Ratio (Part A:Part B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Will cure with the addition of heat
10: 1 Mix Ratio (Part A: Part B)
Will cure with the addition of heat
10: 1 Mix Ratio (Part A: Part B)
Thermally Conductive
Two-part, white, thermally conductive RTV silicone
100:0.2 Mix Ratio (Base: Curing Agent)
Designed for enhanced performance in extreme low and high temperatures
100:0.2 Mix Ratio (Base: Curing Agent)
Designed for enhanced performance in extreme low and high temperatures
Thermally Conductive
Two-part, white, thermally conductive silicone gel
Cures with the addition of heat
20:1 Mix Ratio (Part A:B)
Cures with the addition of heat
20:1 Mix Ratio (Part A:B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
15:1 Mix Ratio (Part A:B)
Cures with the addition of heat
15:1 Mix Ratio (Part A:B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
Designed to allow bond line thicknesses ? 50 microns
20:1 Mix Ratio (Part A:Part B)
Cures with the addition of heat
Designed to allow bond line thicknesses ? 50 microns
20:1 Mix Ratio (Part A:Part B)
Thermally Conductive
Two-part, gray, thermally conductive RTV silicone
100:0.2 Mix Ratio (Base: Curing Agent)
Designed for enhanced performance in extreme low and high temperatures
100:0.2 Mix Ratio (Base: Curing Agent)
Designed for enhanced performance in extreme low and high temperatures
Thermally Conductive
Two-part, gray, thermally conductive silicone
Based on a dimethyl silicone polymer
Uses a platinum-catalyzed addition cure
20:1 Mix Ratio (Part A:B)
Based on a dimethyl silicone polymer
Uses a platinum-catalyzed addition cure
20:1 Mix Ratio (Part A:B)
Thermally Conductive
One-Part, white RTV silicone
Non-slumping in thin sections
Non-corrosive
Designed for enhanced performance in extreme low and high temperatures
Non-slumping in thin sections
Non-corrosive
Designed for enhanced performance in extreme low and high temperatures
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
Designed to allow bond line thicknesses 50 microns
20:1 Mix Ratio (Part A:Part B)
Cures with the addition of heat
Designed to allow bond line thicknesses 50 microns
20:1 Mix Ratio (Part A:Part B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
15:1 Mix Ratio (Part A:B)
Cures with the addition of heat
15:1 Mix Ratio (Part A:B)
Pressure Sensitive Adhesives - Aerospace/Defense
Two-part pressure sensitive adhesive
Retains adhesive qualities in the presence of minor liquid and particulate contaminants
Properties unaffected by normal pressure variations and high temperature exposure
100:1 Mix Ratio (Part A solids: Part B))
Retains adhesive qualities in the presence of minor liquid and particulate contaminants
Properties unaffected by normal pressure variations and high temperature exposure
100:1 Mix Ratio (Part A solids: Part B))