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Thermally Conductive

Product
Cure System
Mix Ratio
Viscosity
Extrusion Rate
Thermal Conductivity
Data Sheet
Comment
Platinum
20:1
140 g/minute
0.64 W/(mK)
Data Sheet
*22) 0.6 W/mK, Thin Bond Line
Platinum
122 g/minute
0.95 W/(mK)
Data Sheet
Gel, soft and compliant
Platinum
10:1
300,000 cP
0.79 W/(mK)
Data Sheet
*22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp
Platinum
10:1
900,000 cP
1.11 W/(mK)
Data Sheet
*22) 1.1 W/mK
Showing 11 to 14 of 14 entries