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Thermally Conductive x Aerospace/Defense x
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0.6430.9530.7521.4920.410.510.6110.6810.7910.8310.841111.1111.2211.2511.4611.611.951

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Thermally Conductive

Product ▲▼
Cure System ▲▼
Mix Ratio ▲▼
Viscosity ▲▼
Extrusion Rate ▲▼
Thermal Conductivity ▲▼
Data Sheet
Comment
Platinum
10:1
300,000 cP
0.79 W/(mK)
Data Sheet
*22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp
Platinum
15:1
N/A
N/A
1.25 W/(mK)
Data Sheet
50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)
Platinum
20:1
140 g/minute
0.64 W/(mK)
Data Sheet
*22) 0.6 W/mK, Thin Bond Line
Platinum
122 g/minute
0.95 W/(mK)
Data Sheet
Gel, soft and compliant
Platinum
1:1
2,000 cP
0.4 W/(mK)
Data Sheet
0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV.
Platinum
20:1
0.84 W/(mK)
Data Sheet
Smooth Paste;0.8 W/mK, 5 hr. pot life.
Platinum
15:1
1.46 W/(mK)
Data Sheet
Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride)
Oxime
1 PART
N/A
40 g/minute
0.61 W/(mK)
Data Sheet
*22) 0.6 W/mK, Low Temperature
Platinum
1:1
50,000 cP
0.95 W/(mK)
Data Sheet
*22) 1.0 W /mK, *5) Primed Lap Shear 120 psi (0.8 MPa)
Alkoxy
100:0.2
1.22 W/(mK)
Data Sheet
*22) 1.2 W/mK, *3) Primed Lap Shear 475 psi (3.3 MPa)
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