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Thermally Conductive
Product
Cure System
Mix Ratio
Viscosity
Extrusion Rate
Thermal Conductivity
Data Sheet
Comment
Platinum
15:1
N/A
N/A
1.25 W/(mK)
50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)
Platinum
10:1
300,000 cP
0.79 W/(mK)
*22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp