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Adhesives/Sealants - Aerospace/Defense
Product
Cure System
Rheology
Durometer
Work Time
Data Sheet
Comment
Platinum
Use for RFI and EMI shielding in electrical and space applications. For applications requiring shorter work times, easy clean-up, and consistent bond thickness.
Platinum
Thixotropic / non-slump
19 Type A
Thixotropic, dispensable, and 0.5mm maximum slump. Shipped and stored frozen.
Alkoxy
Flowable / Self Leveling
50 Type A
4 hours
Long Worktime, Low Density* 1, )Primed Lap Shear 100 psi (0.69 MPa)
Acetoxy
Flowable / Self Leveling
25 Type A
Primerless Adhesive;Self leveling. General all purpose adhesive for a variety of substrates.
Oxime
Thixotropic / non-slump
45 Type A
N/A
For applications requiring a broader operating temperature range. Available in black and white. 200 psi (1.4 MPa), Unprimed lap shear.
Oxime
Thixotropic / non-slump
35 Type A
N/A
Non-slump. Adhesive for a variety of substrates on or near electronic components. 485 psi (3.6 MPa), primed (SP-120) lap shear.
Platinum
Flowable / Self Leveling
30 Type A
30 minutes
Tough, self leveling and good adhesion to various metals. Recommended for broad temperature applications. 400 psi (2.8 MPa), primed (CF1-135) lap shear.