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Thermally Conductive x Aerospace/Defense x
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2 hours73 hours32.5 hours21 hours11.5 hours110 minutes13.5 hours14 hours15 hours15.5 hours190 minutes1
0.6430.9530.7521.4920.410.510.6110.6810.7910.8310.841111.1111.2211.2511.4611.611.951

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Thermally Conductive

Product ▲▼
Cure System ▲▼
Mix Ratio ▲▼
Viscosity ▲▼
Extrusion Rate ▲▼
Thermal Conductivity ▲▼
Data Sheet
Comment
Platinum
20:1
140 g/minute
0.64 W/(mK)
Data Sheet
*22) 0.6 W/mK, Thin Bond Line
Platinum
122 g/minute
0.95 W/(mK)
Data Sheet
Gel, soft and compliant
Platinum
1:1
2,000 cP
0.4 W/(mK)
Data Sheet
0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV.
Platinum
10:1
300,000 cP
0.79 W/(mK)
Data Sheet
*22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp
Platinum
15:1
N/A
N/A
1.25 W/(mK)
Data Sheet
50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)
Platinum
20:1
1 W/(mK)
Data Sheet
*22) 1.0 W/mK, *4) Primed Lap Shear 375 psi (2.6 MPa)
Platinum
15:1
70,000 cP
0.75 W/(mK)
Data Sheet
0.75 W/mK, 4 hr. pot life. (Contains Boron Nitride)
Platinum
15:1
3,560,000 cP
1.49 W/(mK)
Data Sheet
*22) 1.5 W/mK *,4 ) Primed Lap Shear 160 psi (1.1 MPa)
Platinum
20:1
140 g/minute
0.64 W/(mK)
Data Sheet
0.64 W /mK (Tested per ASTM E1530)
Platinum
10:1
130,000 cP
0.83 W/(mK)
Data Sheet
*22) 0.8 W/mK, *4) Primed Lap Shear 205 psi (1.4 MPa), Low Viscosity
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