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Product
Product Type
Description
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
15:1 Mix Ratio (Part A:B)
Cures with the addition of heat
15:1 Mix Ratio (Part A:B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
Designed to allow bond line thicknesses ? 50 microns
20:1 Mix Ratio (Part A:Part B)
Cures with the addition of heat
Designed to allow bond line thicknesses ? 50 microns
20:1 Mix Ratio (Part A:Part B)
Thermally Conductive
Two-part, gray, thermally conductive RTV silicone
100:0.2 Mix Ratio (Base: Curing Agent)
Designed for enhanced performance in extreme low and high temperatures
100:0.2 Mix Ratio (Base: Curing Agent)
Designed for enhanced performance in extreme low and high temperatures
Thermally Conductive
Two-part, gray, thermally conductive silicone
Based on a dimethyl silicone polymer
Uses a platinum-catalyzed addition cure
20:1 Mix Ratio (Part A:B)
Based on a dimethyl silicone polymer
Uses a platinum-catalyzed addition cure
20:1 Mix Ratio (Part A:B)
Thermally Conductive
Two-part, gray, thermally conductive silicone with high strength
Cure may be heat accelerated
20:1 Mix Ratio
(Part A:Part B)
Cure may be heat accelerated
20:1 Mix Ratio
(Part A:Part B)
Thermally Conductive
Two-part, white, thermally conductive, pourable silicone
Cure may be heat accelerated
15:1 Mix Ratio (Part A:Part B)
Cure may be heat accelerated
15:1 Mix Ratio (Part A:Part B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Cure may be heat accelerated
15:1 Mix Ratio (Part A: Part B)
Cure may be heat accelerated
15:1 Mix Ratio (Part A: Part B)
Thermally Conductive
One-Part, white RTV silicone
Non-slumping in thin sections
Non-corrosive
Designed for enhanced performance in extreme low and high temperatures
Non-slumping in thin sections
Non-corrosive
Designed for enhanced performance in extreme low and high temperatures
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
Designed to allow bond line thicknesses 50 microns
20:1 Mix Ratio (Part A:Part B)
Cures with the addition of heat
Designed to allow bond line thicknesses 50 microns
20:1 Mix Ratio (Part A:Part B)
Thermally Conductive
Two-part, white, thermally conductive silicone
Cures with the addition of heat
15:1 Mix Ratio (Part A:B)
Cures with the addition of heat
15:1 Mix Ratio (Part A:B)
Thermally Conductive
Two-part, white, thermally conductive, low viscosity silicone elastomer
Cures with the addition of heat
1:1 Mix Ratio (Part A: Part B)
Cures with the addition of heat
1:1 Mix Ratio (Part A: Part B)
Thermally Conductive
Two-part, white, thermally conductive, electrically insulating, silicone system
Electrically insulative and non-corrosive
15:1 Mix Ratio (Part A: Part B)
Electrically insulative and non-corrosive
15:1 Mix Ratio (Part A: Part B)
Thermally Conductive
Two part, Black, 1:1 Mix ratio (A:B)
Pourable and self-leveling
Cures at room temperature
REACh and RoHS compliant
Tested per UL-94 and passed V-0
Pourable and self-leveling
Cures at room temperature
REACh and RoHS compliant
Tested per UL-94 and passed V-0
Thermally Conductive
Two part, Gray, 1:1 Mix ratio (A:B)
Pourable and self-leveling
Cures at room temperature
REACh and RoHS compliant
Pourable and self-leveling
Cures at room temperature
REACh and RoHS compliant
Specialty Polymers
A clear, dimethyl polysiloxane endblocked with vinyl dimethyl groups, with 7.5 mole % vinyl groups along the chain backbone for increased crosslinking ability
Other viscosities and percentages of vinyl are available on a special order basis
Other viscosities and percentages of vinyl are available on a special order basis