Whitepapers - Electronics
NuSil Technology's commitment to silicone education is manifested in part by our investment in
Whitepapers. Although many of the documents are in true Whitepaper format, we provide additional
resources like a Terms & Definitions document and an Adhesive / Primer study. While some papers are
broad in scope, others are industry specific. Papers are typically added monthly. Registering with
our site will allow you to review the complete library and receive e-mails about new paper additions.
For further reading, please see our Technical Resources section.
May 22, 2012
Characterization of Fuel Resistant Fluorosilicones
Silicones are commonly used in automotive applications as potting compounds, adhesives, gaskets, seals and encapsulants due to their ability to remain elastic at low temperatures and resist breakdown at high temperatures or in UV light. In addition to a broad operating temperature range, silicones inherently possess high dielectric strength (=...
May 21, 2012
Novel Adhesions Methods for Solar Cell Assemblies
Traditionally, engineers and solar cell assemblers have used liquid silicone adhesives to bond solar cells to panel substrates such as satellites, and silicones with high light transmittance to bond cover glasses to cells. Using next generation silicone technology, low outgassing silicone pressure sensitive adhesives (PSA) and thin film sheeting can...
Apr 2, 2012
LED Packaging with Silicone Encapsulants
A Light Emitting Diode (LED) is not “one size fits all.” While many LEDs may appear similar, various applications call for different needs. Whether one is deciding how to construct the LED or what the final application is going to be, decisions on what material to use can vary drastically.
Jan 9, 2012
Choosing a Silicone for Joining Technologies
Engineers and material scientists are constantly looking for a polymeric adhesive that can perform in a broad operating temperature range, maintain chemical stability and offer unique mechanical properties. The dynamic attributes of silicone adhesives, sealants, coatings and encapsulants provide design engineers with a variety of solutions to the complex challenges...
Apr 4, 2011
Choosing a Silicone Encapsulant for Photovoltaic Applications
Non-phenyl containing 1.41 RI silicones have been used for several years for bonding solar arrays in the satellite industry. Phenyl groups on the siloxane polymer can change various properties of the silicone. Understanding how phenyl affects these properties allows the engineer to understand the benefits and risks when...
Dec 15, 2009
Versatility and Flexibility from Low Outgassing Silicones
Miniaturization of electronic packages has led to using thinner and more fragile materials. This, in combination with the use of lead-free solder with solder reflow temperatures up to 260°C, can cause high shear stress during heating and cooling that can damage a device. Subsequently, there is growing interest in...
May 18, 2008
Material and Process Innovations with Filled Silicone Elastomers
Today the technological progress of modern military aircraft design has been greatly influenced by the use of advanced composite materials. These materials permit design of lighter stronger more flexible aircraft yet offers a new set of challenges in design, production and quality.
Feb 13, 2008
A Characterization of Yellowing Caused by UV Radiation on Silicone Encapsulants, and Improvements in Future Materials
This study evaluates twenty-one samples for their change in optical transmission due to a 680-6800J/cm2 dose of UV radiation.
Samples were made from UV curing acrylate, epoxy and silicone chemistries. All samples were prepared and exposed the same way
so that comparisons between the samples would be meaningful. Given the same dosage...
Jan 18, 2008
Evaluation of Removal Rate of Cured Silicone Adhesive from Various
Electronic Packaging Substrates by Solvent and Silicone Digesters for
Reworking electronic packages is an integral process related to diagnostics and
salvaging valuable materials. It is a meticulous and time-consuming procedure that
requires some knowledge of the package material composition to determine compatible
cleaning solutions and processes. Silicone adhesives are being used more frequently due
to their ability to minimize shear stress during temperature...
Nov 28, 2006
Solvent Resistance of Silicones used for Electronic Packaging Applications
Silicones are becoming more popular in advanced packaging for their thermal stability above 200oC and ability to protect the electronic package from environmental factors. The electronic package may be exposed to a variety of different solvents by fabricators in the cleaning process. Problems arise when the silicone swells with solvent.
Jul 31, 2006
Overcoming Package Stress in Flip Chips with Low Outgassed Silicone Materials to Reduce Contamination
The EU mandates for lead free solders are often soldered at higher temperatures than lead and have created a need for electronic packaging materials that can handle these thermal cycling extremes. Thermal Interface Materials (TIMs) and Underfills based on low outgassed silicone chemistry can aid the designer in overcoming thermal...
Mar 18, 2005
Low Outgassing Materials for Electro-Optic and Electronic Systems
This paper explores the need for low outgassing, thermally stable, high performance materials for electrooptic and electronic systems, citing various applications of low outgassing materials in electro-optic and electronic systems. This paper also describes the chemistry of silicone polymerization, identifying the source of outgassing components in silicones as well as...
Jun 8, 2004
Adhering to Difficult Substrates
Adhesive echnology is equal parts chemistry and ‘black magic’. Because there are so many different substrates, each adhesive can not be actually tested before hand on each and everyone. However, by testing on some novel substrates, or difficult to adhere to, inferences can be made which can narrow the choices...
Sep 25, 2003
Silicone Adhesives and Primers on Low Surface Energy Plastics and High Strength Metals
This paper will demonstrate the ability of silicone adhesives, with the aid of primers, to adhere to low surface energy plastics and to high strength metals. In general, some plastics are difficult to adhere to because of their low surface energy, available bond sites, and chemical interaction. Most plastic have...
Feb 17, 2003
Accelerating Cure of Silicone Adhesives
This paper will demonstrate the availability of dramatically accelerating the cure of certain silicone adhesives and their advantage to the manufacturing process. A ‘fast cure’ adhesive is defined as full cure in less than ten minutes—or partial cure for handling under five minutes and full cure at room temperature in...