NuSil Technology Introduces One-Part Glob-Top for Electronic Packaging Applications
Nov 8, 2006
Carpinteria, California - November 8, 2006 - NuSil Technology, a cuttingedge manufacturer of silicone-based materials for
healthcare, aerospace, electronics and photonics, announces the addition of EPM-2411-2, a low outgassing, one-part, silicone glop-top,
to its line of electronic packaging materials (EPMs).
NuSil’s EPM-2411-2 is designed for the encapsulation of chip packages in devices where outgassing-related contamination
poses a problem. This product exhibits the low stress and wide operating temperature ranges that are characteristically associated
with silicone-based materials.
“We constantly look for ways to increase the efficiency of our products in customers’ production and assembly lines,”
said Brian Nash, vice president of Marketing and Sales. “This one-part material eliminates the time-consuming process associated
with mixing a traditional two-part system and is ready to go out of the box.”
EPM-2411-2 is stored and shipped frozen in 3cc and 30cc syringes, as well as 3- and 6-oz. tubes. For more information, please contact
NuSil Technology directly at (805) 684-8780..