Low Outgassing Dielectric Gels
NuSil Technology has a new addition to its Electronic Packaging Materials line. This new addition is three low outgassing,
dielectric gels: EPM-2480,
NuSil's EPM-2480, EPM-2481 and EPM-2482 were designed for the encapsulation of chip packages in devices where outgassing
related contamination poses a problem.
These products cure into a soft and compliant silicone which helps reduce stress
on electronic assemblies during temperature cycling as well as protect against environmental factors and shock.